| 摘要 |
PURPOSE:To economize a package material, and to reduce a mounting space to a printed board by mounting a plurality of combs to a single package and semiconductor chips separately to the combs. CONSTITUTION:A plurality of combs are mounted to a single package 1 and semiconductor chips 4, 5 each independently to the combs. Leads 2, 3 for the combs are arranged separately in response to the die-bonding areas of the surface and the back. Consequently, a plurality of the semiconductor chips 4, 5 are incorporated into the single package 1. Accordingly, a package material is economized, and a mounting space to a printed board is reduced. |
