发明名称 LASER BEAM SOLDERING METHOD
摘要 PURPOSE:To perform a quick and correct soldering with a small sized device by sucking, locating with the ascent and transferring the faced component of a shed with the sucking member of the loading head with a laser light projecting part, and bringing it into contact with its descent with the holding base plate placed on a placing base and irradiating a laser light. CONSTITUTION:The state and position of a faced component 9 are decided by a positioning member 3 by ascending by sucking the faced component 9 of a stock yard 8 by the free lifting sucking member 14 of the loading head 1 to which the laser light projecting part 7 by an optical fiber 6 is fitted. The loading head is transferred to just the above of the holding base plate 12 located on a placing base 11 and with the descent of the sucking member 14 the faced component 9 is abutted. With irradiating the laser light 13 in this state the soldering is immediately performed. Consequently the conventional adhesive coating stage and hardening stage are eliminated and with a small sized simplified device the soldering can be performed quickly and correctly.
申请公布号 JPS62248564(A) 申请公布日期 1987.10.29
申请号 JP19860091349 申请日期 1986.04.22
申请人 NEC CORP 发明人 MIURA HIROSHI
分类号 B23K3/00;B23K1/005;B23K26/00;B23K26/20;H05K3/34;H05K13/04 主分类号 B23K3/00
代理机构 代理人
主权项
地址