| 摘要 |
PURPOSE:To prevent the increase of input capacitance viewed from external- signal input pins even when a plurality of bonding pads for the same external signal are formed onto a semiconductor chip by each shaping a specific switch means and a bonding pad for changing over a switch onto the semiconductor chip. CONSTITUTION:At least two bonding pads 3a, 3d for the same external signal connected to the same internal circuit 8 for a semiconductor chip 1 are formed onto one semiconductor chip 1. A switch means 19 selectively connecting the connecting path systems of said each bonding pad 3a, 3d for the same external signal to said internal circuit 8 and a bonding pad 11 for changing over a switch in which a signal for determining the state of the selection of the switch means 19 is inputted are shaped onto said semiconductor chip 1 in such a semiconductor device. Said switch means 19 is constituted of parts, such as an N channel MOS transistor 14, inverters 12, 13, P channel MOS transistors 15, 18 and N channel MOS transistors 16, 17. |
