| 摘要 |
PURPOSE:To detect a wiring pattern with an incomplete section easily even when the wiring pattern with the imcomplete section is shaped when manufacturing a semiconductor device by forming a ring wiring electrically insulated from each element in a pellet section and having prober pads at both terminals to the peripheral section of the pellet section. CONSTITUTION:A ring wiring 6 electrically insulated from each element in a pellet section P and having probe pads 7, 8 at both terminals is shaped to the peripheral section of the pellet section P in the pellet section P in the vicinity of at least wafer periphery of a wafer to which elements are formed. When the tip of a prober is brought into contact with the prober pads 7, 8 for the ring wiring 6 and large test currents are caused to flow through such a pellet section P, an incomplete section 6a in the ring wiring 6 is melted, and the wiring 6 is disconnected. The disconnection is detected by a tester to which the prober is connected. Marker treatment is executed to the pellet section P in which the disconnection is detected, and the pellet section is removed selectively by a post-process.
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