| 摘要 |
PURPOSE:To prevent statics-caused breakdown while suppressing core stop by a method wherein a resistor is inserted between a die mount, whereon a semiconductor element is to be installed, and each of lead patterns. CONSTITUTION:A die mount area 12 is provided with a grounding pattern 12a and, between the die mount area 12 and each of IC connecting lead patterns 13, there is a 500OMEGA-5MOMEGA resistor 17 printed by using a paste of a polyimide or the like that contains powered carbon. The IC-connecting lead patterns 13 are connected to the die mount area 12 across resistors 17. With the die mount area 12 being grounded by means of the grounding pattern 12a, increase in potential due to statics may be properly suppressed even when the IC-connecting lead patterns 13 are exposed to the outside with the intermediary of an external connecting terminal. This prevents breakdown due to statics. |
