| 摘要 |
PURPOSE:To realize a large current amplification factor while holding high voltage resisting characteristics by bonding a section between an emitter at a two stage and a base at a three stage by a good conductor and lowering resistance between the emitter and the base. CONSTITUTION:The section between the surface of the emitter E2' at the two stage and the base B3' at the three stage are bonded by a wire such as an aluminum wire 12. An electric path through the wire bonding corresponds to a low- resistance current path r2', the resistance of the path can be made sufficiently smaller than a resistor R2', and the current amplification factor can be increased while holding high voltage resisting property. |
