| 摘要 |
PURPOSE:To provide a LED recording head capable of being manufactured by a simple work and having mechanical stability, by forming a bonding relay part between an LED array chip and a driver circuit chip. CONSTITUTION:The relay parts 7 being provided between the LED array chip 3b and driver circuit chips 4 on a semiconductive support substrate 2 are spatially provided on the same plane as the LED array chip 3b and the driver circuit chips 4 and comprise an insulating material from the aspect of material quality. The bonding pads 8 formed on the surface of each relay part 7 are regularly arranged on the surface thereof and electrically insulated from the ones adjacent to each other. The bonding pads 9a, 8, 9b on the LED array chips 3b, the relay parts 7 and the driver circuit chips 4 are subjected to bonding connected by connection wires 6a. The connection wires may be fixed onto each relay part, for example, by an adhesive or a silicone resin so as to perform relay. |
