发明名称 |
Semiconductor memory and method for fabricating the same. |
摘要 |
<p>In a semiconductor memory a capacitor (1) is formed by utilizing a groove (17) formed in a semiconductor substrate (10). The sidewalls of the groove are covered by an insulating layer consisting of a first (18) and a second (19) insulating film. The interior of the groove is filled with conductive material. An area occupied by each memory cell can be made very small and a distance between the memory cells can also be made very small, accordingly, high denisty integration is facilitated.</p> |
申请公布号 |
EP0241948(A1) |
申请公布日期 |
1987.10.21 |
申请号 |
EP19870107371 |
申请日期 |
1983.02.09 |
申请人 |
HITACHI, LTD. |
发明人 |
SUNAMI, HIDEO;KURE, TOKUO;KAWAMOTO, YOSHIFUMI |
分类号 |
H01L21/8242;G11C11/401;G11C11/404;H01L21/822;H01L27/04;H01L27/10;H01L27/108;H01L29/78 |
主分类号 |
H01L21/8242 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|