| 摘要 |
PURPOSE:To obtain a piezoelectric oscillation chip with high reliability and excellent characteristics such as anti-shock, CI and aging characteristics by etching the end face after the end face of a piezoelecric plate is polished so as to eliminate chipping or cracking. CONSTITUTION:Major planes of plural piezoelectric plates 11 cut into a pre scribed size are stuck by an adhesive 10 and glass 12 is abutted on both the sides. Then the end face of the piezoelectric plate 11 being the peripheral part of the block 2 formed in this way is polished and the block 2 is immersed for 10-60 min in a 20% aq. soln. 1 of powder ammonium fluoride as an etching liquid, then the end face of the peripheral part of the piezoelectric oscillator chip 3 is etched (4) and the corner is eliminated. In applying chamfering in this way, no chipping nor cracking is caused in the processing and the piezoelec tric oscillator chip with high reliability is obtained.
|
