| 摘要 |
<p>A magnetic bubble memory device comprising a chip assembly having a plurality of bubble memory chips (10,11) superposed one above the other on a main printed wiring film (30). The lowermost chip is electrically connected to wiring patterns formed on the main printed wiring film (30). Each of the upper chip or chips is mounted on an auxiliary printed witing film (40) and electrically connected to the wiring patterns of the main printed wiring film through the auxiliary printed wiring film. The chip assembly is assembled with coils (60, 61, 62) for generating a revolutional magnetic field disposed in a magnetic shield case (92) in such a manner that the bubble memory chips are disposed inside of the coils and both ends of the main printed wiring film are disposed outside of the coils for outer connection.</p> |
