发明名称 Near-line spring connect structure for flexible interconnect circuits.
摘要 <p>A printhead for a thermal ink jet printer or the like is brought into good electrical contact with raised electrical contacts on a flexible interconnect circuit by the use of a molded near-linear spring connect structure. This novel structure includes a horizontal central locating member from which a plurality of resilient hollow cylinders extend vertically upward and in alignment with the electrical contacts on the flexible interconnect circuit. Since there is a near-linear deflection of the cylinder walls with increasing force applied thereto, good electrical contact is achieved between the printhead and the flex circuit using a minimum of force, thereby minimizing the likelihood of damage to the printhead.</p>
申请公布号 EP0240710(A2) 申请公布日期 1987.10.14
申请号 EP19870102972 申请日期 1987.03.03
申请人 HEWLETT PACKARD COMPANY 发明人 HARMON, JOHN P.
分类号 B41J2/05;B41J2/015;H01R12/00;H05K1/11;H05K3/36 主分类号 B41J2/05
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