| 摘要 |
<p>PURPOSE:To erase an imprinted part by laser readily and to make it possible to perform clearer imprinting again, by including a process for applying a thermosetting resin on the imprinted surface of a semiconductor device, a process for thermally hardening the thermosetting resin, and a process for laser imprinting on the surface of the thermally hardened resin. CONSTITUTION:In order to erase an imprinted part, a black thermosetting resin 3 is applied on the entire surface of the imprinted surface. Thus an affected layer 2a is coated and the imprinted part is concealed. Heat treatment is performed, and the thermosetting resin 3 is hardened. Laser light from a YAG laser imprinting unit is projected on an imprinted surface 4 of the surface of the thermally hardened resin. An affected layer 4a is formed at a part of imprinted characters. Thus re-imprinting is performed. The laser imprinting is performed as follows: the laser light is made to pass a character mask, which is provided in a light path; the laser light is formed in the shape of the beam in the character form; and said laser light is projected on the imprinting surface of the black thermosetting resin. Therefore, excellent contrast is yielded between the affected part 4a, on which the laser light is projected, and a part of the imprinted part4, on which the laser light is not projected.</p> |
