| 摘要 |
PURPOSE:An electrically conductive coating compound which contains copper powder, has improved electrical conductivity and is solderable, consisting of metallic copper powder, a specific resin blend, a metallic salt of fatty acid and a metallic chelate-forming agent. CONSTITUTION:(A) Metallic copper powder is blended with (B) a resin blend comprising (i) a p-tert-butylphenolic resin, (ii) a metallic surface activating resin (preferably active rosin or maleinized rosin) and (iii) a thermosetting resin (e.g. resol type phenolic resin, etc.), (C) a metallic salt of a saturated or unsaturated fatty acid (e.g. potassium oleate, etc.) and (D) a metallic chelate- forming agent (e.g. triethanolamine, etc.) to give the aimed coating compound. The blending ratio is preferably 1-8pts.wt. component C and 1-50pts.wt. component D based on 100pts.wt. total amounts of 85-95wt% component A and 15-5wt% component B (2-30wt% component i, 2-30wt% component ii and the rest of the component iii).
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