| 摘要 |
PURPOSE:To decrease the occurring rate of the separation of resin and to obtain a highly reliable semiconductor device, by forming cut parts such as holes, grooves, notches at the bent parts of leads or in the vicinities thereof so that the cut parts are extended into a resin part. CONSTITUTION:A semiconductor device is composed of the following parts: a rectangular small pellet l, on which a semiconductor integrated circuit is formed; a lead frame 3, from both side parts of which leads 2... are protruded; a resin part 4; and the like. Long holes 6... are formed at bent parts 5... of the lends 2.... The parts of the long holes 6... are extended into the resin part 4. The bonding area of the resin at the root parts of the leads 3..., which are protruded out of the resin part 4, is expanded. The bonding force between the resin part 4 and the leads 2... is strengthened. Separation of the resin part 4 and the leads 2... due to the action of external force hardly occurs. Deterioration of reliability as electronic parts due to the intrusion of harmful material through the separated parts can be prevented. |
