| 摘要 |
PURPOSE:To enable the setting of optimal processing temperature for a member, by arranging a light emitting section allowed to be inserted in a die and a light receiving section which receives light released from the light emitting section to control the temperature of a heating plate freely. CONSTITUTION:A molded member 4 is inserted between heating plates 5 and 6 to determine a set temperature with a sequencer and a smoothing is done at the resulting temperature. A part of light released from an LED array 10 is reflected on the molded member 4 and received with a 1-D image sensor 11. As a set heating temperature is raised, the reflectance increases sharply to above a set value, which is determined as a processing possible temperature. The LED array 10 may be an LED while the 1-D image sensor 11 may be an optical fiber.
|
