发明名称 SUPERSONIC BONDING DEVICE
摘要 PURPOSE:To provide a supersonic bonding device capable of preventing the biting of a substance to be bonded by a method wherein a multitude of fine grooves is formed on the outer surface of a bearer to expand an area to receive supersonic wave while the bearer is attached rotatably to permit to change a supersonic projecting surface properly. CONSTITUTION:When a predetermined length of a packing material A is supplied, a cylinder 18 is operated to clamp the packing material A between a clamping plate 17 and a base plate 15. A driving means 13 is operated under this condition to move a supersonic oscillator and a bearer 2 integrally and the bonding of the packing material A is effected by supersonic wave from a horn 4. The supersonic wave from the horn 4 is received by the side surface of the rotary body 8 of the bearer 2, however, the rotary body 8 is formed with fine grooves 8a to expand the area for receiving the supersonic wave, therefore, the heat dissipating area of the titled device is increased. On the other hand, projections, interposed between the rotary body 8 and the fine groove 8a, contact with the packing material A upon bonding, therefore, the fine grooves 8a will never be contacted with the packing material A and a given cavity is formed between the packing material A. Accordingly, ventilation is effected through the fine grooves 8a, therefore, the cooling of the rotary body 8 may be effected efficiently to prevent the heat generation of the rotary body whereby thermal affection, such as the cutting or the like of the packing material A, will never be affected on the material to be bonded.
申请公布号 JPS62225323(A) 申请公布日期 1987.10.03
申请号 JP19860069377 申请日期 1986.03.27
申请人 YUUWA SANGYO KK 发明人 SUZUKI SANJI;MURANO TOSHIKAZU
分类号 B29C65/08;B65B51/10 主分类号 B29C65/08
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