| 摘要 |
PURPOSE:The titled composition suitable as printed circuit boards, having improved high-frequency electric characteristics and heat resistance, obtained by blending a specific polybutadiene-epoxy compound with 1,2-polybutadiene. CONSTITUTION:(A) 100pts.wt. compound obtained by reacting A1: 1 equivalent of a terminal carboxyl group modified butadiene polymer which contains >=50% 1,2-butadiene unit containing a double bond on the side chain in the polymer chain with A2: 1.2-1.5 equivalent epoxy compound containing two or more epoxy groups in 1mol is blended with (B) 50-150pts.wt. butadiene polymer which contains >=50% 1,2-polybutadiene unit containing a double bond in the side chain in the polymer chain and has 1,000-200,000 number-average mol.wt. The blend is dissolved in an organic solvent and blended with an organic peroxide and an epoxy curing agent to give varnish, which is impregnated into sheet substrates and the sheet substrates are laminated.
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