| 摘要 |
PURPOSE:To protect a bonding pad electrode part of an interconnection metal layer effectively from corrosion, by making an opening part for bonding of the first passivation film covered with the second passivation film. CONSTITUTION:An interconnection metal layer 13 is formed on an insulating film 12, the first passivation film 141 is formed by PSG to expose a region in accordance with a bonding pad of the interconnection metal layer 13. Then, the second passivation film 142 is piled and formed of nitriding silicon and an opening 15 for bonding is formed in accordance with the opening part of the first passivation film 141. In this case, the periphery of the opening part of the first passivation film 141 is completely covered with the second passivation film 142. Hence, even if water permeates into the pad part of the interconnection metal layer through the casing or the bonding wire, the interconnection metal layer is effectively protected from corrosion without impurity- oxide such as phosphor generated. |
