| 摘要 |
PURPOSE:To contrive the securement of positioning accuracy and the prevention of the generation of dust in a device which positions a wafer on the wafer chuck by an external shape reference system by a method wherein a shifting means, which makes the wafer slide in the direction away from the positional reference at the time of recovery of the wafer from the wafer chuck, and a movement limiting means, which limits the slipping dimension at a constant value, are provided. CONSTITUTION:A wafer chuck 1 is provided with a lifting cylinder 4 as a shifting means to slant the wafer chuck 1 and a flow stop pin 3 as a position limiting means. After this, the wafer chuck is moved to the position of an exposure process, an exposure ends and if the chuck is again returned, the air is again introduced in the wafer chuck 1, a wafer 7 is held being slightly levitated by the lifting cylinder 4 and the wafer 7 is made to slide in the direction away from a push-butting roller 2. At this time, the wafer is not largely slipped out of the chuck by the slipping-prevention pin 3. Then, when the wafer is vacuum sucked to the chuck 1 at the position and the cylinder 4 is made to descend, the wafer chuck 1 is again returned to a horizontal state and the wafer is carried out in a housing belt 14 by an automatic hand 11. The wafer recovery position by the hand 11 and so on is never displaced at random and the rubbing of the wafer edge with the positional reference at the time of carrying-out of the wafer can be avoided.
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