| 摘要 |
PURPOSE:To obtain a power semiconductor element having high reliability by preventing a heat-transmission over various electrical component parts on a control circuit substrate of heat generated by a semiconductor element for power on a power circuit substrate. CONSTITUTION:A space section 22 in which an air layer is shaped is formed between a power circuit substrate 1 and a laminated circuit substrate 2 while a communicating hole 24 through which the air layer is communicated with the outside is shaped to the peripheral wall section of a resin outer frame 4 for molding. Consequently, heat generated by a semiconductor element 10 for power arranged onto the power circuit substrate 1 is heat-insulated by the air layer generating the convection of the space section 22 in the power semiconductor device. Accordingly, the conduction of heat to the control circuit substrate 2 is prevented, thus obviating the thermal deterioration of various electrical component parts 12 on the control circuit substrate 2.
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