| 摘要 |
PURPOSE:To dispense with a bonding wire and a bonding material and to manufacture an electronic element inexpensively, by coupling a surface electrode of a chip directly to a lead frame by means of a conductor ball. CONSTITUTION:A surface electrode of an IC chip 2 is provided with a gold ball 4. The surface electrode and the end portion of a lead frame 3 are superposed with said gold ball 4 interposed between them and are subjected to thermal contact bonding, so that the lead frame 3 is connected to and fixed on the IC chip 2. Thereafter the IC chip 2 is resin-molded together with the end portion of the lead frame 3, while the lead frame 3 is cut in a prescribed length, and thus an IC element 1 is completed. Accordingly, this IC element 1 has a construction wherein the end portion of the lead frame 3 is coupled directly to the surface electrode of the IC chip 2 with the gold ball 4 interposed between them and is connected thereto electrically. |
