| 摘要 |
PURPOSE:To obtain a bump structure inexpensively by forming a bump electrode made of a metal ball press-bonded by bonding on an electrode layer on a substrate to form the bump electrode without complicate wafer process. CONSTITUTION:Metal wirings 51 may be formed of fine wirings made of Au, Al or Cu used for normal wire bonding, and a ball 52 may be formed by a hydrogen torch attached to a normal ball bonder. Then, a bonding corresponding to a primary bonding in the normal bonding is achieved, and the ball is preferably formed larger than that at wire bonding time. After the ball 52 is press- contacted by a capillary 6 and thermally press-bonded to an electrode layer 4, the capillary 6 is raised to hold the wirings 51 by clamping means of the bonder and to pull it up to remove by cutting the wirings at the top of the ball 52. Then, a bump electrode 5 of 20mum high remains. Thus, the formation of the bump electrode of necessary number of terminals is repeated to be completed. |
