发明名称 |
Surface mounted component transport mechanism |
摘要 |
There is herein described an improved surface mounted component (SMC) transport mechanism which accepts a multiple number of such components from a plurality of carrier media and transports them to a desired location, for example, adjacent a printed circuit board (PCB) prior to the mounting of the SMC onto the PCB.
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申请公布号 |
US4694570(A) |
申请公布日期 |
1987.09.22 |
申请号 |
US19850800217 |
申请日期 |
1985.11.21 |
申请人 |
AMISTAR CORPORATION |
发明人 |
RUDOLPH, JOHN M.;WOHLHIETER, GEORGE M. |
分类号 |
H05K13/02;(IPC1-7):H05K3/30 |
主分类号 |
H05K13/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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