| 摘要 |
PURPOSE:To smoothly feed a semiconductor device to the treatment device used in the next process by a method wherein housing and feeding devices of a semiconductor device are provided between each processing device on a manufacturing line. CONSTITUTION:The housing and feeding devices are provided between each processing device on a manufacturing line, and a semiconductor device 2 on a conveying belt is passed, temporarily stopped, housed and supplied in conformity with the treatment speed of the processing device of the next process. The semiconductor feeding operation to the conveying belt is completely reverse to the operation of feeding. A vertically moving member 13 is moved up, and after it is stopped at the prescribed position, all the stacked semiconductor devices 2 by moving back the first separation bar 7 are supported by the vertically moving member 13. Then, when the vertically moving member 13 is moved down after the second separation bar 8 has been projected between the semiconductor device 2 at the lowest part and the lead 2a of the second semiconductor device 2, the semiconductor device 2 at the lowest part is moved down together with the vertically moving 13, and all the semiconductor devices 2 from the second sheet and up are supported by the second separation bar 8. As a result, the working ratio of the processing device and the productivity of the semiconductor device can be enhanced.
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