发明名称 DIAPHRAGM
摘要 PURPOSE:To directly bond and fix a shield case with an upper side ceramic diaphragm and to strengthen the adhering strength by clamping a conductive layer with the upper and a lower ceramic diaphragms. CONSTITUTION:Aluminium powder and additive are weighed and mixed, organic resin what is called as an organic binder is mixed to the obtained product to form a mixture split, the mixture split is formed in a form of paper, thereby the lower ceramic diaphragm 2, what is called as a green sheet, is formed. Then, paste having the essential component of tungsten powder is screen printed on the upper surface of the lower ceramic diaphragm 2 to form the conductive layer 4. The upper ceramic diaphragm 3 formed similarly is adhered to the lower ceramic diaphragm 2 and the conductive layer 4 is held between the upper and the lower ceramic diaphragms 2, 3 in the form of sandwich to constitute the diaphragm 1.
申请公布号 JPS62214800(A) 申请公布日期 1987.09.21
申请号 JP19860057337 申请日期 1986.03.15
申请人 OMRON TATEISI ELECTRONICS CO 发明人 HORIIKE SUMIO;MORITA YOSHIYUKI;AKATA HIDEAKI
分类号 H04R17/00;H04R17/02 主分类号 H04R17/00
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