发明名称 PREPARATION OF LAMINATED BOARD
摘要 <p>PURPOSE:To prepare a laminated board generating no warpage with good dimensional stability, by using a polyvinyl fluoride film as a release film. CONSTITUTION:An epoxy resin type composite copper clad laminated board 1 is constituted by arranging a paper base material impregnated with an epoxy resin at the central part and respectively arranging glass base materials 3a, 3b impregnated with the epoxy resin to both outsides thereof and placing a copper foil 4 to the outermost layer in the single side. These laminated board materials are successively laminated on a mirror surface plate in a superposed state and the back surface of the laminated board is directly contacted with the mirror surface plate through the epoxy resin impregnated glass base material 3b but, if the epoxy resin is directly contacted with the mirror surface plate, the release of said laminated board becomes impossible and, therefore, said board is laminated by interposing a polyvinyl fluoride film 5 as a release film. No convex warpage is generated in the base board side in the etching process of the obtained laminated board.</p>
申请公布号 JPS62212133(A) 申请公布日期 1987.09.18
申请号 JP19860056686 申请日期 1986.03.13
申请人 MATSUSHITA ELECTRIC WORKS LTD 发明人 SUZUKI SHIGEO;WAKAO RYUICHI
分类号 B32B37/10;B32B15/08;B32B37/00;H05K3/02 主分类号 B32B37/10
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