| 摘要 |
PURPOSE:To provide a projection always at a specific position in an inner lead and to realize stable connection, by printing the inner lead on the top face of a conductor layer and a projected pattern on the rear face thereof simultaneously by means of a duplex exposing apparatus. CONSTITUTION:Photoresist 3 is applied on both faces of a conductor layer 2 which is bonded to an insulating layer 1. Circuit patterns including an inner lead 8 are formed on the top face of the conductor layer 2 while projected patterns are formed on the rear face thereof, both by exposing and printing them simultaneously and then developing them simultaneously. Both the top and rear faces of the conductor layer 2 are half etched by spraying an etching solution. Any unrequired conductor layer portion left unetched is removed by etching from the top face of the conductor layer 2 and the circuit patterns including the inner lead 8 are formed thereon. The resists 3 and 7 are removed with a peeling solution. In this manner, a projections is provided at a predetermined position in the inner lead 8 and thus stable connection is realized.
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