RESIN SEAL TYPE SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF

摘要

PURPOSE:To remove the intrusion of external moisture from a resin seal section, and to improve reliability by forming a film having not only excellent adhesion with a sealing resin but also superior adhesion with a metal in a lead section to a section to be sealed with the resin in the lead section. CONSTITUTION:An oxide layer consisting of a metal different from a metal for a lead section is shaped selectively on the whole circumferential surface of the lead section in at least one part of a section to be brought into contact with a sealing resin in the lead section through a vapor phase method, and a thin first metallic oxide layer composed of the oxide of the metal for the lead section and a thick second metallic oxide layer having excellent adhesion with the metal for the lead section on the first metallic oxide layer are formed. The film thickness of the second metallic oxide layer is brought preferably to one thousand times from seventy times as large as that of the first metallic oxide layer in the upper surface and lower surface of the lead section. Alumina having superior adhesion with metals for the lead section is preferable as a second metallic oxide when iron or copper or these alloy is used as the metals for the lead section. Accordingly, excellent reliability can be kept for a prolonged term.