发明名称 |
METHOD OF CONNECTING BY LANDLESS THROUGH-HOLE |
摘要 |
At least two conductors are electrically connected through a dielectric material by providing a dielectric material having a first conductor on a first surface thereof and a temporary support layer covering the first conductor and the first surface of the dielectric material. A second surface on the dielectric material opposite the first surface is provided with a second conductor and a temporary support layer covering the second conductor and second surface of the dielectric material. Interstitial through-holes are provided to connect the first and second conductors. The through-holes are plated with an electrical conductor to thereby electrically connect the first and second conductors. The support layers are then mechanically removed such as by peeling to thereby provide a landless electrical connection between the first and second electrical conductors. |
申请公布号 |
JPS62206897(A) |
申请公布日期 |
1987.09.11 |
申请号 |
JP19860292651 |
申请日期 |
1986.12.10 |
申请人 |
INTERNATL BUSINESS MACH CORP <IBM> |
发明人 |
REROI NIYUUERU CHIERISU;SERON RARUU ERISU |
分类号 |
H05K3/20;H05K3/42 |
主分类号 |
H05K3/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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