| 摘要 |
<p>PURPOSE:The titled tape, obtained by applying a compound colorable by irradiation to one surface of a base material, capable of improving the wafer chip detection accuracy by a photosensor and suitable to a dicing process for semiconductor wafers. CONSTITUTION:A sheet 1 obtained by applying a compound 4 colorable by irradiation onto at least one surface of a base material 2 and forming an adhesive layer 3 consisting of an adhesive and a radiation polymerizable compound, preferably urethane acrylate based oligomer. A leuco dye, particularly 4,4',4'- trisdimethylaminotriphenylmethane is preferably used as the radiation polymerizable compound and the above-mentioned compound is preferably added to the base material 2.</p> |
