| 摘要 |
PURPOSE:To equalize the thickness of a solder layer, and to improve the reliability of the mechanical strength of solder joint sections by making the size of the solder joint surfaces of an electrode plate and a stress-buffer metallic upper plate equal. CONSTITUTION:When an electrode plate 1 and a stress buffer metallic upper plate 3, solder joint surfaces thereof take the same size, are passed through a reflow furnace, solder between the electrode plate 1 and the stress-buffer metallic upper plate 3 does not protrude from end plates by the action of surface tension on the state of melting of board solder 2, thus easily obtaining desired solder thickness.
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