发明名称 FORMATION OF RESIN BOARD
摘要 PURPOSE:To extremely rapidly perform the forming of a resin board and improve the energy efficiency to a far greater extent by a method wherein a top force and/or a bottom force are heated and then a resin board is set between the top force and the bottom force so as to be press-molded into a predetermined shape with application of high-frequency currents. CONSTITUTION:The molding surface of a bottom force 3 is heated up to an temperature of 40-100 deg.C by feeding steam to a stem pipe 6. In the above- mentioned state, a resin board 7 is set between a top force 2 and the bottom force 3. The resin board 7 is produced by binding the mixture of fibers and thermoplastic synthetic resin by binder, which is softened by heating through the contact of the resin board 7 with the bottom force 3. By applying high-frequency currents through cords 4 and 5 in the state that the binder is in softened state by heating and the resin board 7 is pinchedly pressed between the top force 2 and the bottom force 3, the resin board 7 is rapidly heated up to the setting temperature of the binder by high-frequency induction heating and consequently the binder sets and the resin board is formed into a predetermined shape.
申请公布号 JPS62201213(A) 申请公布日期 1987.09.04
申请号 JP19860044546 申请日期 1986.02.28
申请人 IKEDA BUSSAN CO LTD 发明人 HAYASHI YOSHIHISA
分类号 B29C43/02;B29C43/52;B29K105/06 主分类号 B29C43/02
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