| 摘要 |
PURPOSE:To prevent a package resin from cracking in a semiconductor device having external leads and sealed with resin by performing a waterproof process at the contacting portion of the leads with the sealing resin. CONSTITUTION:The resin 12 of a package 14 is covered with a film 22 of waterproof agent 21 together with the contacting portion 19 of external leads 11 and the resin 12. Then, when only the leads 11 are covered with a solder 15 and when soldering to mount the leads on a substrate, moisture invaded into a package 14 is not evaporated by heat. Thus, it can prevent the resin of the package 14 from cracking. |
