| 摘要 |
<p>PURPOSE:To obtain an inexpensive and highly precise semiconductor device, by coating at least one of the surfaces of infrared-ray transmitting epoxy resin with an infrared-ray intercepting substance. CONSTITUTION:The upper and lower surfaces of infrared-ray transmitting epoxy resin 6 sealing up frames 1 and 4 whereon an infrared-ray emitting diode 3 and a light-receiving element are mounted respectively are coated with a light- intercepting substance 7 formed of ink or a film, for instance, which intercepts infrared rays. The ink or the film as the infrared-ray intercepting substance 7 is applied, by using a means such as a rubber roller, on the surfaces of the while infrared-ray transmitting epoxy resin 6 which is molded in the shape of the frames by transfer molding. Therefore, the device can be manufactured very simply and is free at all from false operation even under the direct rays of the sun or the like, since the infrared-ray intercepting substance 7 intercepts infrared rays from the outside. Thus a very stable photocoupler is obtained.</p> |
