| 发明名称 |
Ceramic wiring substrate and method of forming it. |
| 摘要 |
<p>A ceramic wiring substrate has at least one layer of a signal line pattern, a ground electrode pattern layer, and a cavity formed by a region which covers part of or completely the signal line pattern inside ceramic between the signal line pattern and the ground electrode pattern.</p> |
| 申请公布号 |
EP0233085(A2) |
申请公布日期 |
1987.08.19 |
| 申请号 |
EP19870301224 |
申请日期 |
1987.02.12 |
| 申请人 |
NEC CORPORATION |
发明人 |
IKEDA, TERUYUKI;UTSUMI, KAZUAKI |
| 分类号 |
H05K3/46;H01L21/48;H01L23/538;H01L23/64;H05K1/02;H05K1/03 |
主分类号 |
H05K3/46 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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