| 摘要 |
PURPOSE:To manufacture a large quantity of hybrid integrated circuits by performing the process same as that heretofore in use by a method wherein a plurality of hybrid integrated circuits are formed on the region adjoining to slit holes, and the hybrid integrated circuits are individually separated by using the slit holes. CONSTITUTION:Slit holes 3, having the width almost same as that of a metal substrate 1, are formed in the longitudinal direction of the substrate leaving the prescribed interval by performing a press-punching. Then, the resist of pattern of a conductive circuits 4 of the prescribed shape is printed in such a manner that a plurality of hybrid integrated circuits can be formed on the metal substrate 1 surrounded by the slit holes 3. The metal substrate 1 is passed through an etchant, the conductive circuit 4 of the desired shape is formed by performing an etching on a copper foil, the circuit element 5 such as a transistor, an integrated circuit, a chip capacitor, a chip resistor and the like is fixed to the conductive circuits 4 or between the conductive circuits 4, and the desired wiring is formed. Then, the metal substrate 1 is cut at the end part of the slit holes 3 indicated by one-dot chain line and at about the center part of the metal substrate 1, and it is separated into hybrid integrated circuits 6 respectively. |
