| 摘要 |
PURPOSE:To enable the die repairing generating no blowhole at all by packing a low melting point metal by melting to the part to be repaired on the surface of the die to be repaired, by executing a plating treatment by scraping the packed metal part rised after the solidification and by performing the surface finishing further. CONSTITUTION:The pin hole peripheral side part of the die 1 on which the pin hole 2 of the body to be repaired is formed is preheated to about 50-60 deg.C. A solder 3 is then filled up in the pin hole 2 by flowing a low melting point metal, for instance the melted solder 3 of lead and so on into the pin hole 2. Thereafter, the part of the pinhole part only is packed with the solder 3 completely by scraping the part of the solder 3 built-up on the surface of the die 1. The face to be plated (repairing place) 6 is then degreased by electrolytic clearing by masking the periphery of the pat 6 to be plates which is cut off at the tip of the die 1 by a vinyl tape and so on. The smooth die face which completely packed the pin hole 2 of the die 1 is obtd. by smoothing the plated face with further surface finishing by executing a plating treatment of about 30mum thickness by an electrolytic padding machine 4 in succession.
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