| 摘要 |
PURPOSE:To apply a flat plastic package to a power IC by extending the area of a tab made of a metal to the whole planar contour of the package while thinly forming the thickness of the package section on the back of the tab. CONSTITUTION:In a semiconductor device 1 constituted as a power system linear IC, a tab 3 made of a metal holding a semiconductor chip is molded and sealed into a plastic package 6 together with leads 4. The planar contour shape of the tab 3 is magnified and shaped so as to be approximately formed along the planar contour shape of the package 6. The whole tab 3 is surrounded by the package 6 at the same time, and the thickness (d) of a plastic package section 61 in a section coating the back surface of the tab 3 is thinly shaped selectively. Consequently, heat generation from the chip 2 is dissipated from a wide area. Transfer resistance through the package 6 is reduced at the same time. Accordingly, the device 1 can also be applied to the power system IC. |
