| 摘要 |
PURPOSE:To perform automatic inspection speedily with high accuracy by picking up an image of a conforming chip component and generating a reference signal, picking up an image of a substrate to be inspected where a chip part to be inspected is packaged and finding the correlation between this image pickup signal and reference signal, and deciding the package state judging from the correlation value. CONSTITUTION:The conforming chip component is fitted on a base 8 and its image is picked up by a television camera 3, whose image is projected on a monitor television 9. An instruction is outputted from a computer terminal equipment 11 over a look at an image plane 9a and sent from a computer 12 to the monitor television 9 through a video memory 10 to move the cursor of the monitor television 9. When two diagonal points of the chip component 13 are indicated, the image pickup signal of the conforming component is stored as reference data in a reference memory 5. An image of the substrate to be inspected where the chip component is packaged normally is picked up and the computer 12 compute a coefficient of correlation by making signal data on the entire image plane 9a of the monitor television 9 correspond to reference signal data one to one.
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