发明名称 CURABLE RESIN
摘要 PURPOSE:To obtain the titled resin which can be easily synthesized and gives a cured product excellent in heat resistance and mechanical strength, by bonding a specified epoxy resin/phenol adduct with a vinyl ester resin through a diisocyanate. CONSTITUTION:An epoxy resin having at least two epoxy groups in the molecule, such as a compound of formula I, is reacted with a monohydric phenol at an epoxy group to OH group molar ratio of about 1 to obtain an epoxy resin/phenol adduct (A) having at least two OH groups and at least two aryloxymethylene groups in the molecule, such as a compound of formula II. An epoxy resin having at least two epoxy groups in the molecule, such as a compound of formula III, is reacted with (meth)acrylic acid at an epoxy group to COOH group equivalent ratio of about 1 to obtain a vinyl ester resin (B) having at least two (meth)acryloyl groups and at least two OH groups in the molecule, such as a compound of formula IV. An isocyanate-added resin such as a resin of formula V, obtained by effecting an addition reaction of component A with an isocyanate (C) such as 2,4-tolylene diisocyanate is reacted with component B to obtain the titled resin of, e.g., formula VI.
申请公布号 JPS62184011(A) 申请公布日期 1987.08.12
申请号 JP19860025693 申请日期 1986.02.10
申请人 SHOWA HIGHPOLYMER CO LTD 发明人 TAKIYAMA EIICHIRO;ARAI MICHIAKI;ARAI TAKAO
分类号 C08F299/06;C08F290/00;C08G18/67 主分类号 C08F299/06
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