| 摘要 |
<p>A process for step etching a metal tape 10 adapted for use in tape automated bonding comprises forming an etch resist pattern 31 on the tape 26 having a first portion 32 defining a pattern of leads 31 and a second portion 34 within the first portion 32 defining steps in the leads 17. The metal tape 26 is etched in the regions not covered by the resist at a desired rate and etched in the regions for forming the step at a reduced rate as compared to the desired rate, thereby forming the tape 26 having a plurality of leads 17 corresponding to the resist pattern 31 with each of the leads 17 having a step therein generated by the second portion 34 of the resist pattern 31. The metal tape 26 formed by the process has a unique structure wherein the web between bumps 26 formed at the end of the leads 19 and the remainder of the leads 17 has a unique channel beam cross section for stiffening the web which is relatively thin as compared to the leads 17 or the bump 24.</p> |
