| 摘要 |
PURPOSE:To permit the polishing free from the dispersion of thickness of a wafer by a shortened process by carrying out the surface grinding and polishing for the wafer in the vacuum adsorbed state and press-attaching said wafer onto a polishing plate. CONSTITUTION:A wafer 2 having the minute unevenness on the surface is fixed firmly and in separable ways by the vacuum attraction through a number of vacuum attraction holes 3, onto the surface plate 1 of a surface grinder. In this state, a rotary grindstone 4 is shifted horizontally along the diameter of the wafer 2, and after the back surface of the wafer 2 is ground a buffing surface plate 5 for polishing is attached, and the back surface of the wafer 2 is polished flat. Then, the coating of wax 6 is carried out, and a polishing plate 7 is pressing-attached, and then a vacuum chuck is released to separate the wafer 2 from the surface plate 1 of the surface grinder. Thus, the wafer free from the dispersion of thickness can be polished flat by the shortened process. |
