| 摘要 |
PURPOSE:To form a protective film to a highly accurate thickness by preliminarily forming a conductive film having the thickness approximately equal to the film thickness when the polishing of the protective film is completed to an electrode terminal part then subjecting the protective film to plane polishing to expose the conductive film after formation of the protective film and completing the polishing of the protective film when the electrical conduction between the electrode terminals is taken. CONSTITUTION:A metallic plating underlying layer 20 is formed on the electrode terminals 19 and the film of Cu is selectively formed by electroplating on the underlying layer 20 to form the conductive film 21 to the parts corresponding to the electrode terminals 19. The thickness of the conductive film 21 in this stage is set to the film thickness at when the plane polishing of the protective film 17 in a post stage ends. After the protective film 17 is formed to cover the entire surface of a substrate, the protective film 17 is subjected to mechanical plane polishing and the polishing is stopped in the position where the surface of the conductive film 21 is exposed, i.e., when a polishing plane B-B is attained. The timing for stopping the polishing is known from the electrical conduction of the conductive film 21 coupled to a coil. |
