| 摘要 |
PURPOSE:To accurately inspect package components on a printed board without reference to the colors of the printed board and package components by coating the printed board previously with solder where a fluorescent agent is mixed. CONSTITUTION:A wiring pattern is formed on the printed board P and preflux where the fluorescent agent is mixed is applied over the entire surface after a punching process. The fluorescent agent mixed with the preflux is intense enough to withstand disturbing light and weak enough to prevent an end part of a component from blurring owing to fluorescent light. The board P coated with the preflux is coated by screen printing with solder paste for connecting terminals of package components to specific positions of the wiring pattern of the board, but a fluorescent agent is mixed with it as well. Then, the board P is irradiated by a mercury vapor lamp 1 from above and visible light emitted by the fluorescent agent applied over the substrate P is picked up by a TV camera 3 through a dichroic mirror 2, so that a clear image of the component C is picked up in silhouette by the light emission of the fluorescent agent. |
