发明名称 METHOD OF PRELIMINARY SOLDERING FOR IC LEAD
摘要 <p>PURPOSE:To eliminate the need for an exhaust duct system by a method wherein a creamy solder is used for the elimination of flux application and wash processes. CONSTITUTION:Simultaneously with the going up of a left-hand scraper 13, a right-hand scraper 14 comes down and moves along the direction A indicated by an arrow, pushing out a creamy solder 12 to fill up a recess 15 provided on the surface of a specific fixing board 11. In this process, no creamy solder 12 wil stick to the surfaces of a fixing board 10 and the specific fixing board 11. An IC 16 with its lead 16a coated by the creamy solder 12 is sucked up by an adsorbing section 17 catching the molded portion of the IC 16. The adsorbing section 17 is caused to incline for exposure to an arrow-indicated non-contact heat beam 18. The creamy solder 12 melts, reaching the other face of the lead 16a for the completion of the preliminary soldering process. When soldering is completed for one of the sides, the adsorbing section turns around by 90 deg., for the accomplishment of preliminary soldering for each of the sides, one after the other.</p>
申请公布号 JPS62179139(A) 申请公布日期 1987.08.06
申请号 JP19860020240 申请日期 1986.02.03
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 SETA JUNZO
分类号 H01L23/50;H05K3/34 主分类号 H01L23/50
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