发明名称 |
METHOD FOR DEPOSITING A METAL ON A SURFACE |
摘要 |
<p>UNITED STATES PATENT APPLICATION OF: YU-LING TENG RICHARD MAYERNIK FOR: IMPROVED METHOD FOR DEPOSITING A METAL ON A SURFACE An improved method for making conductive metal patterns involving the steps of treating a substrate with a solution comprising a reducible salt of a non-noble metal and a light radiation sensitive reducing compound, exposing said substrate to light radiant energy, fixing with a solution comprised of a complexing agent followed by electroless deposition, the improvement comprising extending the bath life o said fixing solution by maintaining the concentration of the light sensitive reducing compound on the fixing solution so that it does not exceed 0.4 m moles/liter.</p> |
申请公布号 |
CA1224957(A) |
申请公布日期 |
1987.08.04 |
申请号 |
CA19840461667 |
申请日期 |
1984.08.23 |
申请人 |
KOLLMORGEN TECHNOLOGIES CORPORATION |
发明人 |
TENG, YU-LING;MAYERNIK, RICHARD A. |
分类号 |
C23C18/14;C23C18/16;C23C18/20;C23C18/40;H05K3/18;H05K3/28;(IPC1-7):H05K3/18 |
主分类号 |
C23C18/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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