摘要 |
PURPOSE:To enable the high-speed plating of a hoop by carrying out plating with an ammoniacal soln. contg. Pd ions, Ni ions and 1,3,6-naphthalenesulfonate each at a specified concn. at a specified bath temp. and a specified cathode current density. CONSTITUTION:An ammoniacal soln. of about 7-10 pH contg. 30-50g/l Pd ions in the form of palladium chloride or the like, 30-70g/l Ni ions in the form of nickel chloride or the like and 1-5g/l 1,3,6-naphthalenesulfonate such as sodium or potassium 1,3,6-naphthalenesulfonate as a stress relieving agent is prepd. as a plating soln. A hoop is plated with the soln. at 40-50 deg.C bath temp. and 1-20A/dm<2> cathode current density. Thus, plating can be carried out at about 5mum/min deposition rate, a plating alloy consisting of about 50-95wt% Pd and about 5-50wt% Ni is formed and a plated surface having specular gloss is obtd.
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