发明名称 ANISOTROPIC CONDUCTING MATERIAL AND PACKAGING METHOD FOR SEMICONDUCTOR DEVICE USING SAID MATERIAL
摘要 PURPOSE:To obtain an anisotropic conducting material characterized by high adhesion and high resolution and make it possible to perform highly reliable packaging, by forming a conductive intermediate layer on the surface of a spherical particle such as a spherical macromolecule, and forming a conductive particle. CONSTITUTION:A spherical core material 21 comprising benzoguanamine resin having a uniform particle diameter is synthesized. A nickel layer is formed as a conductive intermediate layer 22 on the surface of the core material. Finally, an insulating surface layer 23 comprising a thermoplastic resin layer of styrene and butadiene is formed on the surface of the layer 22, and a microcapsule is formed. Thus an anisotropic conducting layer is obtained. The material is mixed with ethanol and the like. Said microcapsule in a paste state is applied on a bonding pad BP1 and its vicinity on a wiring substrate 11 by a screen printing method. Thereafter, the ethanol and the like are evaporated through a pre-baking process. Then, a semiconductor chip 12 provided with a bonding pad BP2 is mounted in a face down attitude. Heating is performed on the side of the semiconductor chip, and pressure is applied. Thus the connection is completed.
申请公布号 JPS62176139(A) 申请公布日期 1987.08.01
申请号 JP19860017604 申请日期 1986.01.29
申请人 FUJI XEROX CO LTD 发明人 MURAKAMI HIRONORI
分类号 H01L21/60;H01B5/16;H05K3/10;H05K3/32 主分类号 H01L21/60
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