| 摘要 |
PURPOSE:To prevent a wafer from contamination as well as to cut down the cost of production by a method wherein the metal ball, formed by fusing the tip part of a metal wire, is placed on the external electrode, and they are electri cally connected. CONSTITUTION:A solder wire is passed through a capillary 11, an electrical discharge is generated between the tip of the solder wire pulled out from the capillary and a ball forming electrode 12, and a solder ball 13 is formed. Then the ball is picked out from the capillary 11, it is placed on a base metal film 4, supersonic vibrations are applied by a horn 11 while pressure is being applied to the ball 13, and the ball 13 is pressed-bonded to the base metal film 4. Then, the solder wire 16 is cut in the length set in advance, the entire wafer is heated up, and when the solder ball 13 and the solder wire 16 have been fused, the solder ball 13' of the size set in advance can be obtained on the base metal film 4. Through these procedures, the wafer is prevented from contamination by a heavy metal and the like, no metal ball is formed on the chip, and the cost of manufacture can be cut down. |
