| 摘要 |
PURPOSE:To permit releasing of stress after brazing and secure joining by using an active metal-contg. Ag solder plate for one face and Ag solder for the other face and using a metal having a small coefft. of thermal expansion for an intermediate material thereby forming a clad material. CONSTITUTION:A metal or alloy having the small coefft. of thermal expansion, for example, 'Cobal(R)', Fe-Ni42%, Ta, Nb, Mo, etc. are used for the intermediate material 2. The plate 1 consisting of the Ag brazing filler metal contg. 0.5-8wt% active metal is adhered to one face of the intermediate material 2 and the plate 3 consisting of the Ag brazing filler metal having the m.p. approximate to the m.p. of the above-mentioned Ag brazing filler metal is adhered to the other face. The liquidus line temp. of such clad solder is specified to <=850 deg.C. The intermediate material 2 is made into 3 layers and the Ag solder contg. 0.5-8% active metal is inserted between the intermediate materials. The above-mentioned brazing filler metal relieves the stress on ceramics and securely binds the ceramics and metal in brazing of the ceramics and the metal. |
